Search Results - Open Polar - "semiconductors"

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Wafer-level chip-scale packaging for low-end RF products

by Bartek, M., Zilmer, G., Teomin, D., Polyakov, A., Sinaga, S. M., Mendes, P. M., Burghartz, J. N.
Published 2004
“... fabrication aspects and its potential for RF IC packaging. Philips Semiconductors and Philips Research...”

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Wafer-level integration of on-chip antennas and RF passives using high-resistivity polysilicon substrate technology

by Mendes, P. M., Sinaga, S. M., Polyakov, A., Bartek, M., Burghartz, J. N., Correia, J. H.
Published 2004
“... Semiconductors and Philips Research in the context of the Philips Associate Centre at DIMES (PACD); Fundação para...”

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Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives

by Bartek, M., Polyakov, A., Sinaga, S. M., Mendes, P. M., Correia, J. H., Burghartz, J. N.
Published 2004
“..., and processing similar to the single-crystalline silicon. Philips Semiconductors and Philips Research...”

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