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Integrated chip-size antennas for wireless microsystems : fabrication and design Considerations

by Mendes, P. M., Polyakov, A., Bartek, M., Burghartz, J. N., Correia, J. H.
Published in Sensors and Actuators A: Physical (2006)

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Folded-patch chip-size antennas for wireless microsystems

by Mendes, P. M., Polyakov, A., Bartek, M., Burghartz, J. N., Correia, J. H.
Published 2003

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Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging

by Mendes, P. M., Polyakov, A., Bartek, M., Burghartz, J. N., Correia, J. H.
Published 2003

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An integrated folded-patch antenna for wireless microsystems

by Mendes, P. M., Polyakov, A., Bartek, M., Burghartz, J. N., Correia, J. H.
Published 2004

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Wafer-level packaging fo RF applications : using high resistivity polycrystalline silicon substrate technology

by Polyakov, A., Sinaga, S. M., Mendes, P. M., Bartek, M., Correia, J. H., Burghartz, J. N.
Published 2004

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Wafer-level integration of on-chip antennas and RF passives using high-resistivity polysilicon substrate technology

by Mendes, P. M., Sinaga, S. M., Polyakov, A., Bartek, M., Burghartz, J. N., Correia, J. H.
Published 2004

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Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives

by Bartek, M., Polyakov, A., Sinaga, S. M., Mendes, P. M., Correia, J. H., Burghartz, J. N.
Published 2004

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