Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging

This paper reports on design and fabrication options of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems. The antenna is built using a stack of two adhesively bonded wafers with patterned metallization and through-wafer electrical interconnec...

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Bibliographic Details
Main Authors: Mendes, P. M., Polyakov, A., Bartek, M., Burghartz, J. N., Correia, J. H.
Format: Conference Object
Language:English
Published: 2003
Subjects:
On-chip antenna
Through-wafer vias
Glass processing
Laser ablation
Blue whale
Online Access:http://hdl.handle.net/1822/1618
Description
Summary:This paper reports on design and fabrication options of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems. The antenna is built using a stack of two adhesively bonded wafers with patterned metallization and through-wafer electrical interconnects. Different fabrication options based on via formation in glass and/or high-resistivity silicon substrates using excimer laser ablation or powder blasting are analyzed. Fundação para a Ciência e Tecnologia (FCT) (SFRH/BD/4717/2001, POCTI/ESE/38468/2001, FEDER), and EC (project Blue Whale ...

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