Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging

This paper reports on design and fabrication options of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems. The antenna is built using a stack of two adhesively bonded wafers with patterned metallization and through-wafer electrical interconnec...

Full description

Bibliographic Details
Main Authors: Mendes, P. M., Polyakov, A., Bartek, M., Burghartz, J. N., Correia, J. H.
Format: Conference Object
Language:English
Published: 2003
Subjects:
On-chip antenna
Through-wafer vias
Glass processing
Laser ablation
Blue whale
Online Access:http://hdl.handle.net/1822/1618
id ftunivminho:oai:repositorium.sdum.uminho.pt:1822/1618
record_format openpolar
spelling ftunivminho:oai:repositorium.sdum.uminho.pt:1822/1618 2023-05-15T15:45:10+02:00 Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging Mendes, P. M. Polyakov, A. Bartek, M. Burghartz, J. N. Correia, J. H. 2003-11 application/pdf http://hdl.handle.net/1822/1618 eng eng MME. MICROMECHANICS EUROPE WORKSHOP, 14, Delft, 2003 - "Proceedings". Delft : TUDelft, 2003. ISBN 90-808266-1-8. p. 77-80. 90-808266-1-8 http://hdl.handle.net/1822/1618 info:eu-repo/semantics/openAccess On-chip antenna Through-wafer vias Glass processing Laser ablation info:eu-repo/semantics/conferencePaper 2003 ftunivminho 2022-03-20T08:08:36Z This paper reports on design and fabrication options of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems. The antenna is built using a stack of two adhesively bonded wafers with patterned metallization and through-wafer electrical interconnects. Different fabrication options based on via formation in glass and/or high-resistivity silicon substrates using excimer laser ablation or powder blasting are analyzed. Fundação para a Ciência e Tecnologia (FCT) (SFRH/BD/4717/2001, POCTI/ESE/38468/2001, FEDER), and EC (project Blue Whale ... Conference Object Blue whale Universidade of Minho: RepositóriUM
institution Open Polar
collection Universidade of Minho: RepositóriUM
op_collection_id ftunivminho
language English
topic On-chip antenna
Through-wafer vias
Glass processing
Laser ablation
spellingShingle On-chip antenna
Through-wafer vias
Glass processing
Laser ablation
Mendes, P. M.
Polyakov, A.
Bartek, M.
Burghartz, J. N.
Correia, J. H.
Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
topic_facet On-chip antenna
Through-wafer vias
Glass processing
Laser ablation
description This paper reports on design and fabrication options of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems. The antenna is built using a stack of two adhesively bonded wafers with patterned metallization and through-wafer electrical interconnects. Different fabrication options based on via formation in glass and/or high-resistivity silicon substrates using excimer laser ablation or powder blasting are analyzed. Fundação para a Ciência e Tecnologia (FCT) (SFRH/BD/4717/2001, POCTI/ESE/38468/2001, FEDER), and EC (project Blue Whale ...
format Conference Object
author Mendes, P. M.
Polyakov, A.
Bartek, M.
Burghartz, J. N.
Correia, J. H.
author_facet Mendes, P. M.
Polyakov, A.
Bartek, M.
Burghartz, J. N.
Correia, J. H.
author_sort Mendes, P. M.
title Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
title_short Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
title_full Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
title_fullStr Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
title_full_unstemmed Folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
title_sort folded-patch chip-size antennas for wireless microsystems using wafer-level chip-scale packaging
publishDate 2003
url http://hdl.handle.net/1822/1618
genre Blue whale
genre_facet Blue whale
op_relation MME. MICROMECHANICS EUROPE WORKSHOP, 14, Delft, 2003 - "Proceedings". Delft : TUDelft, 2003. ISBN 90-808266-1-8. p. 77-80.
90-808266-1-8
http://hdl.handle.net/1822/1618
op_rights info:eu-repo/semantics/openAccess
_version_ 1766379522642411520

Similar Items