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Implementation of advanced ball printing technology for high yield bumping of wafer chip scale packages

by Manessis, D., Whitmore, M., Staddon, M., Ostmann, A., Aschenbrenner, R., Reichl, H.
Published in 2005 7th Electronic Packaging Technology Conference (2005)
“.... Prior to ball print, flux is printed on the wafer pads by screen printing. The work undertaken forms...”

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