Bond strength of urethane and epoxy-modified adhesives
A number of urethane and epoxy-modified urethane systems were evaluated as room-temperature-curing adhesives. The systems were formulated to yield a variety of modulus levels and to be compatible with certain chemically sensitive materials.
Main Authors: | , , |
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Format: | Report |
Language: | English |
Published: |
Oak Ridge Y-12 Plant
1976
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Subjects: | |
Online Access: | https://doi.org/10.2172/7193527 https://digital.library.unt.edu/ark:/67531/metadc1448429/ |
Summary: | A number of urethane and epoxy-modified urethane systems were evaluated as room-temperature-curing adhesives. The systems were formulated to yield a variety of modulus levels and to be compatible with certain chemically sensitive materials. |
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