Bond strength of urethane and epoxy-modified adhesives

A number of urethane and epoxy-modified urethane systems were evaluated as room-temperature-curing adhesives. The systems were formulated to yield a variety of modulus levels and to be compatible with certain chemically sensitive materials.

Bibliographic Details
Main Authors:	Childress, F. G., Zava, A. K., Miller, C. E.
Format:	Report
Language:	English
Published:	Oak Ridge Y-12 Plant 1976
Subjects:	Joining Adhesives Organic Compounds Carbonic Acid Derivatives Carboxylic Acid Salts 36 Materials Science Medium Temperature Mechanical Properties Organic Nitrogen Compounds Organic Oxygen Compounds 360603* > Materials > Properties Adhesion Urethane Fabrication 360403 > Materials > Polymers & Plastics > Mechanical Properties > (-1987) Carbamates Epoxides Bonding Compatibility Carbonic acid
Online Access:	https://doi.org/10.2172/7193527 https://digital.library.unt.edu/ark:/67531/metadc1448429/

Description
Summary:	A number of urethane and epoxy-modified urethane systems were evaluated as room-temperature-curing adhesives. The systems were formulated to yield a variety of modulus levels and to be compatible with certain chemically sensitive materials.