High temperature syntactic foam
Resins from the polyimide, polybenzimidazole polyamide-imide, phenolic, silicone, and urethane families were formulated with glass microbubbles and carbon microspheres to produce low density, high strength syntactic foams. The polyimide and polybenzimidazole foams were the most thermally stable, but...
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Format: | Report |
Language: | English |
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Bendix Corporation
1977
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Online Access: | https://doi.org/10.2172/7317026 https://digital.library.unt.edu/ark:/67531/metadc1444904/ |
Summary: | Resins from the polyimide, polybenzimidazole polyamide-imide, phenolic, silicone, and urethane families were formulated with glass microbubbles and carbon microspheres to produce low density, high strength syntactic foams. The polyimide and polybenzimidazole foams were the most thermally stable, but even the urethane exceeded the design goals. Foams with high and low thermal conductivity were developed and their material properties were measured. The low conductivity was achieved using glass microbubble fillers and high conductivity was achieved using carbon microsphere fillers. |
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