Improved bondability of molded rigid urethane form by plasma treatment

Most mold releases, including so-called nontransferring releases, interfere with bonding of molded urethane foam. Water-washable mold releases are not readily removable from urethane foams cured at elevated temperatures. Plasma treatment in either argon or oxygen improves the bonding surfaces of mol...

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Bibliographic Details
Main Authors: DeGisi, S.L., Smith, C.H.
Format: Report
Language:English
Published: Bendix Corporation
Subjects:
Joining
Organic Compounds
Dispersions
Carbonic Acid Derivatives
Surface Treatments
Molding
36 Materials Science
Colloids
Urethane
Casting Molds
Organic Nitrogen Compounds 360301* > Composite Materials > Preparation & Fabrication > (-1987)
Foams
Carbamates
Carboxylic Acid Salts
Bonding
Fabrication
Carbonic acid
Online Access:https://digital.library.unt.edu/ark:/67531/metadc1059075/
Description
Summary:Most mold releases, including so-called nontransferring releases, interfere with bonding of molded urethane foam. Water-washable mold releases are not readily removable from urethane foams cured at elevated temperatures. Plasma treatment in either argon or oxygen improves the bonding surfaces of molded urethane foam. Comparable bonding results can be obtained with RF (13.6 MHz), AC (20 kHz), or DC-plasma treatments. The plasma-treated foam surfaces will retain the improved bondability for a considerable length of time. Plasma treatment is effective for epoxy and RTV silicone adhesives. A primer recommended for metal bonding with RTV silicone, together with plasma treatment, produces superior bondability of molded urethane foam parts.

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