Wafer-level chip-scale packaging for low-end RF products

This paper gives a short overview of waferlevel chip-scale packaging technology and analyses its added value in the packaging of RF ICs. Particularly, the possibilities of substrate crosstalk suppression by substrate thinning and trenching together with embedding of rf passives (inductors, antennas)...

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Main Authors: Bartek, M., Zilmer, G., Teomin, D., Polyakov, A., Sinaga, S. M., Mendes, P. M., Burghartz, J. N.
Format: Conference Object
Language:English
Published: IEEE 2004
Subjects:
Wafer level packaging WLP
Chip scale packaging CSP
System-on-chip Soc
Embedded passives
Crosstalk suppression
Blue whale
Online Access:http://hdl.handle.net/1822/1647
id ftunivminho:oai:repositorium.sdum.uminho.pt:1822/1647
record_format openpolar
spelling ftunivminho:oai:repositorium.sdum.uminho.pt:1822/1647 2023-05-15T15:45:11+02:00 Wafer-level chip-scale packaging for low-end RF products Bartek, M. Zilmer, G. Teomin, D. Polyakov, A. Sinaga, S. M. Mendes, P. M. Burghartz, J. N. 2004-09 application/pdf http://hdl.handle.net/1822/1647 eng eng IEEE TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS, Atlanta, 2004 - "Digest of papers". Piscataway : IEEE, 2004. ISBN 0-7803-8703-1. p. 41-44. 0-7803-8703-1 http://hdl.handle.net/1822/1647 info:eu-repo/semantics/openAccess Wafer level packaging WLP Chip scale packaging CSP System-on-chip Soc Embedded passives Crosstalk suppression info:eu-repo/semantics/conferencePaper 2004 ftunivminho 2022-03-20T08:19:21Z This paper gives a short overview of waferlevel chip-scale packaging technology and analyses its added value in the packaging of RF ICs. Particularly, the possibilities of substrate crosstalk suppression by substrate thinning and trenching together with embedding of rf passives (inductors, antennas) are addressed. The Shellcasetype wafer-level packaging solution is used as a study case presenting its fabrication aspects and its potential for RF IC packaging. Philips Semiconductors and Philips Research, Fundação para a Ciência e Tecnologia (FCT) - (SFRH/BD/4717/2001, POCTI/ESE/38468/2001), European Union under FP5 for the project Blue Whale ... Conference Object Blue whale Universidade of Minho: RepositóriUM
institution Open Polar
collection Universidade of Minho: RepositóriUM
op_collection_id ftunivminho
language English
topic Wafer level packaging WLP
Chip scale packaging CSP
System-on-chip Soc
Embedded passives
Crosstalk suppression
spellingShingle Wafer level packaging WLP
Chip scale packaging CSP
System-on-chip Soc
Embedded passives
Crosstalk suppression
Bartek, M.
Zilmer, G.
Teomin, D.
Polyakov, A.
Sinaga, S. M.
Mendes, P. M.
Burghartz, J. N.
Wafer-level chip-scale packaging for low-end RF products
topic_facet Wafer level packaging WLP
Chip scale packaging CSP
System-on-chip Soc
Embedded passives
Crosstalk suppression
description This paper gives a short overview of waferlevel chip-scale packaging technology and analyses its added value in the packaging of RF ICs. Particularly, the possibilities of substrate crosstalk suppression by substrate thinning and trenching together with embedding of rf passives (inductors, antennas) are addressed. The Shellcasetype wafer-level packaging solution is used as a study case presenting its fabrication aspects and its potential for RF IC packaging. Philips Semiconductors and Philips Research, Fundação para a Ciência e Tecnologia (FCT) - (SFRH/BD/4717/2001, POCTI/ESE/38468/2001), European Union under FP5 for the project Blue Whale ...
format Conference Object
author Bartek, M.
Zilmer, G.
Teomin, D.
Polyakov, A.
Sinaga, S. M.
Mendes, P. M.
Burghartz, J. N.
author_facet Bartek, M.
Zilmer, G.
Teomin, D.
Polyakov, A.
Sinaga, S. M.
Mendes, P. M.
Burghartz, J. N.
author_sort Bartek, M.
title Wafer-level chip-scale packaging for low-end RF products
title_short Wafer-level chip-scale packaging for low-end RF products
title_full Wafer-level chip-scale packaging for low-end RF products
title_fullStr Wafer-level chip-scale packaging for low-end RF products
title_full_unstemmed Wafer-level chip-scale packaging for low-end RF products
title_sort wafer-level chip-scale packaging for low-end rf products
publisher IEEE
publishDate 2004
url http://hdl.handle.net/1822/1647
genre Blue whale
genre_facet Blue whale
op_relation TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS, Atlanta, 2004 - "Digest of papers". Piscataway : IEEE, 2004. ISBN 0-7803-8703-1. p. 41-44.
0-7803-8703-1
http://hdl.handle.net/1822/1647
op_rights info:eu-repo/semantics/openAccess
_version_ 1766379526741295104

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