High temperature syntactic foam

Resins from the polyimide, polybenzimidazole polyamide-imide, phenolic, silicone, and urethane families were formulated with glass microbubbles and carbon microspheres to produce low density, high strength syntactic foams. The polyimide and polybenzimidazole foams were the most thermally stable, but...

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Bibliographic Details
Main Author: McIlroy, H.M.
Language:unknown
Published: 2012
Subjects:
36 MATERIALS SCIENCE
CARBON
MICROSPHERES
FOAMS
FABRICATION
THERMAL CONDUCTIVITY
BUBBLES
GLASS
MECHANICAL PROPERTIES
ORGANIC POLYMERS
RESINS
URETHANE
CARBAMATES
CARBONIC ACID DERIVATIVES
CARBOXYLIC ACID SALTS
COLLOIDS
DISPERSIONS
ELEMENTS
NONMETALS
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
PETROCHEMICALS
PETROLEUM PRODUCTS
PHYSICAL PROPERTIES
POLYMERS
THERMODYNAMIC PROPERTIES
Carbonic acid
Online Access:http://www.osti.gov/servlets/purl/7317026
https://www.osti.gov/biblio/7317026
https://doi.org/10.2172/7317026
Description
Summary:Resins from the polyimide, polybenzimidazole polyamide-imide, phenolic, silicone, and urethane families were formulated with glass microbubbles and carbon microspheres to produce low density, high strength syntactic foams. The polyimide and polybenzimidazole foams were the most thermally stable, but even the urethane exceeded the design goals. Foams with high and low thermal conductivity were developed and their material properties were measured. The low conductivity was achieved using glass microbubble fillers and high conductivity was achieved using carbon microsphere fillers.

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