Quantitative comparison of electronic component/solder joint stress relief in encapsulated assemblies

A quantitative comparison was made of various stress relief bends with and without sleeving in three commonly used encapsulants. Silicone rubber and heat shrinkable polyolifin sleeving were used on right angle, full loop, and hump style lead bends. Small (from 254 .mu.m to 762 .mu.m diameter) and la...

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Bibliographic Details
Main Author: Cummings, D.A.
Language:unknown
Published: 2013
Subjects:
36 MATERIALS SCIENCE
ELECTRONIC EQUIPMENT
SOLDERED JOINTS
STRESS RELAXATION
ENCAPSULATION
EPOXIDES
FOAMS
RUBBERS
SILICON
SLEEVES
URETHANE
CARBAMATES
CARBONIC ACID DERIVATIVES
CARBOXYLIC ACID SALTS
COLLOIDS
DISPERSIONS
ELASTOMERS
ELEMENTS
JOINTS
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
ORGANIC POLYMERS
POLYMERS
SEMIMETALS
Carbonic acid
Online Access:http://www.osti.gov/servlets/purl/6316697
https://www.osti.gov/biblio/6316697
id ftosti:oai:osti.gov:6316697
record_format openpolar
spelling ftosti:oai:osti.gov:6316697 2023-07-30T04:02:55+02:00 Quantitative comparison of electronic component/solder joint stress relief in encapsulated assemblies Cummings, D.A. 2013-02-04 application/pdf http://www.osti.gov/servlets/purl/6316697 https://www.osti.gov/biblio/6316697 unknown http://www.osti.gov/servlets/purl/6316697 https://www.osti.gov/biblio/6316697 36 MATERIALS SCIENCE ELECTRONIC EQUIPMENT SOLDERED JOINTS STRESS RELAXATION ENCAPSULATION EPOXIDES FOAMS RUBBERS SILICON SLEEVES URETHANE CARBAMATES CARBONIC ACID DERIVATIVES CARBOXYLIC ACID SALTS COLLOIDS DISPERSIONS ELASTOMERS ELEMENTS JOINTS ORGANIC COMPOUNDS ORGANIC NITROGEN COMPOUNDS ORGANIC OXYGEN COMPOUNDS ORGANIC POLYMERS POLYMERS SEMIMETALS 2013 ftosti 2023-07-11T10:47:09Z A quantitative comparison was made of various stress relief bends with and without sleeving in three commonly used encapsulants. Silicone rubber and heat shrinkable polyolifin sleeving were used on right angle, full loop, and hump style lead bends. Small (from 254 .mu.m to 762 .mu.m diameter) and large (762 .mu.m to 1.27 mm diameter) wires were used to simulate small and large component leads. The component leads were encapsulated in microballoon-filled epoxy, 128 kg/m/sup 3/ urethane foam, and 320 kg/m/sup 3/ urethane foam. Ten test samples were fabricated in each configuration; five were used for tensile loading, and five were used for compressive loading. Other/Unknown Material Carbonic acid SciTec Connect (Office of Scientific and Technical Information - OSTI, U.S. Department of Energy)
institution Open Polar
collection SciTec Connect (Office of Scientific and Technical Information - OSTI, U.S. Department of Energy)
op_collection_id ftosti
language unknown
topic 36 MATERIALS SCIENCE
ELECTRONIC EQUIPMENT
SOLDERED JOINTS
STRESS RELAXATION
ENCAPSULATION
EPOXIDES
FOAMS
RUBBERS
SILICON
SLEEVES
URETHANE
CARBAMATES
CARBONIC ACID DERIVATIVES
CARBOXYLIC ACID SALTS
COLLOIDS
DISPERSIONS
ELASTOMERS
ELEMENTS
JOINTS
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
ORGANIC POLYMERS
POLYMERS
SEMIMETALS
spellingShingle 36 MATERIALS SCIENCE
ELECTRONIC EQUIPMENT
SOLDERED JOINTS
STRESS RELAXATION
ENCAPSULATION
EPOXIDES
FOAMS
RUBBERS
SILICON
SLEEVES
URETHANE
CARBAMATES
CARBONIC ACID DERIVATIVES
CARBOXYLIC ACID SALTS
COLLOIDS
DISPERSIONS
ELASTOMERS
ELEMENTS
JOINTS
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
ORGANIC POLYMERS
POLYMERS
SEMIMETALS
Cummings, D.A.
Quantitative comparison of electronic component/solder joint stress relief in encapsulated assemblies
topic_facet 36 MATERIALS SCIENCE
ELECTRONIC EQUIPMENT
SOLDERED JOINTS
STRESS RELAXATION
ENCAPSULATION
EPOXIDES
FOAMS
RUBBERS
SILICON
SLEEVES
URETHANE
CARBAMATES
CARBONIC ACID DERIVATIVES
CARBOXYLIC ACID SALTS
COLLOIDS
DISPERSIONS
ELASTOMERS
ELEMENTS
JOINTS
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
ORGANIC POLYMERS
POLYMERS
SEMIMETALS
description A quantitative comparison was made of various stress relief bends with and without sleeving in three commonly used encapsulants. Silicone rubber and heat shrinkable polyolifin sleeving were used on right angle, full loop, and hump style lead bends. Small (from 254 .mu.m to 762 .mu.m diameter) and large (762 .mu.m to 1.27 mm diameter) wires were used to simulate small and large component leads. The component leads were encapsulated in microballoon-filled epoxy, 128 kg/m/sup 3/ urethane foam, and 320 kg/m/sup 3/ urethane foam. Ten test samples were fabricated in each configuration; five were used for tensile loading, and five were used for compressive loading.
author Cummings, D.A.
author_facet Cummings, D.A.
author_sort Cummings, D.A.
title Quantitative comparison of electronic component/solder joint stress relief in encapsulated assemblies
title_short Quantitative comparison of electronic component/solder joint stress relief in encapsulated assemblies
title_full Quantitative comparison of electronic component/solder joint stress relief in encapsulated assemblies
title_fullStr Quantitative comparison of electronic component/solder joint stress relief in encapsulated assemblies
title_full_unstemmed Quantitative comparison of electronic component/solder joint stress relief in encapsulated assemblies
title_sort quantitative comparison of electronic component/solder joint stress relief in encapsulated assemblies
publishDate 2013
url http://www.osti.gov/servlets/purl/6316697
https://www.osti.gov/biblio/6316697
genre Carbonic acid
genre_facet Carbonic acid
op_relation http://www.osti.gov/servlets/purl/6316697
https://www.osti.gov/biblio/6316697
_version_ 1772813794523742208

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