Quantitative comparison of electronic component/solder joint stress relief in encapsulated assemblies

A quantitative comparison was made of various stress relief bends with and without sleeving in three commonly used encapsulants. Silicone rubber and heat shrinkable polyolifin sleeving were used on right angle, full loop, and hump style lead bends. Small (from 254 .mu.m to 762 .mu.m diameter) and la...

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Bibliographic Details
Main Author: Cummings, D.A.
Language:unknown
Published: 2013
Subjects:
36 MATERIALS SCIENCE
ELECTRONIC EQUIPMENT
SOLDERED JOINTS
STRESS RELAXATION
ENCAPSULATION
EPOXIDES
FOAMS
RUBBERS
SILICON
SLEEVES
URETHANE
CARBAMATES
CARBONIC ACID DERIVATIVES
CARBOXYLIC ACID SALTS
COLLOIDS
DISPERSIONS
ELASTOMERS
ELEMENTS
JOINTS
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
ORGANIC OXYGEN COMPOUNDS
ORGANIC POLYMERS
POLYMERS
SEMIMETALS
Carbonic acid
Online Access:http://www.osti.gov/servlets/purl/6316697
https://www.osti.gov/biblio/6316697
Description
Summary:A quantitative comparison was made of various stress relief bends with and without sleeving in three commonly used encapsulants. Silicone rubber and heat shrinkable polyolifin sleeving were used on right angle, full loop, and hump style lead bends. Small (from 254 .mu.m to 762 .mu.m diameter) and large (762 .mu.m to 1.27 mm diameter) wires were used to simulate small and large component leads. The component leads were encapsulated in microballoon-filled epoxy, 128 kg/m/sup 3/ urethane foam, and 320 kg/m/sup 3/ urethane foam. Ten test samples were fabricated in each configuration; five were used for tensile loading, and five were used for compressive loading.

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