Improved bondability of molded rigid urethane form by plasma treatment
Most mold releases, including so-called nontransferring releases, interfere with bonding of molded urethane foam. Water-washable mold releases are not readily removable from urethane foams cured at elevated temperatures. Plasma treatment in either argon or oxygen improves the bonding surfaces of mol...
Main Authors: | , |
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Language: | unknown |
Published: |
2015
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Online Access: | http://www.osti.gov/servlets/purl/5153852 https://www.osti.gov/biblio/5153852 https://doi.org/10.2172/5153852 |
Summary: | Most mold releases, including so-called nontransferring releases, interfere with bonding of molded urethane foam. Water-washable mold releases are not readily removable from urethane foams cured at elevated temperatures. Plasma treatment in either argon or oxygen improves the bonding surfaces of molded urethane foam. Comparable bonding results can be obtained with RF (13.6 MHz), AC (20 kHz), or DC-plasma treatments. The plasma-treated foam surfaces will retain the improved bondability for a considerable length of time. Plasma treatment is effective for epoxy and RTV silicone adhesives. A primer recommended for metal bonding with RTV silicone, together with plasma treatment, produces superior bondability of molded urethane foam parts. |
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