Thermoelectric Outer Planets Spacecraft (TOPS) electronic packaging and cabling development summary report

Electronic packaging and cabling activities performed in support of the Thermoelectric Outer Planets Spacecraft (TOPS) Advanced Systems Technology (AST) project are detailed. It describes new electronic compartment, electronic assembly, and module concepts, and a new high-density, planar interconnec...

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Bibliographic Details
Main Authors: Dawe, R. H., Arnett, J. C.
Format: Other/Unknown Material
Language:unknown
Published: 1974
Subjects:
ELECTRONICS AND ELECTRICAL ENGINEERING
Gage
DML
Online Access:http://hdl.handle.net/2060/19750008664
Description
Summary:Electronic packaging and cabling activities performed in support of the Thermoelectric Outer Planets Spacecraft (TOPS) Advanced Systems Technology (AST) project are detailed. It describes new electronic compartment, electronic assembly, and module concepts, and a new high-density, planar interconnection technique called discrete multilayer (DML). Development and qualification of high density cabling techniques, using small gage wire and microminiature connectors, are also reported.

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