Mountain permafrost dynamics within a recently exposed glacier forefield inferred by a combined geomorphological, geophysical and photogrammetrical approach

Abstract Geomorphological observations, geoelectrical soundings and photogrammetric measurements of surface movement on the Muragl glacier forefield were used to obtain an integrative analysis of a highly complex glacial and periglacial landform consisting of a push moraine, creeping permafrost and...

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Bibliographic Details
Published in:Earth Surface Processes and Landforms
Main Authors: Kneisel, C., Kääb, A.
Format: Article in Journal/Newspaper
Language:English
Published: Wiley 2007
Subjects:
Ice
Online Access:http://dx.doi.org/10.1002/esp.1488
https://api.wiley.com/onlinelibrary/tdm/v1/articles/10.1002%2Fesp.1488
https://onlinelibrary.wiley.com/doi/pdf/10.1002/esp.1488
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Summary:Abstract Geomorphological observations, geoelectrical soundings and photogrammetric measurements of surface movement on the Muragl glacier forefield were used to obtain an integrative analysis of a highly complex glacial and periglacial landform consisting of a push moraine, creeping permafrost and permafrost‐free glacial till in close proximity. Electrical resistivity tomography is considered as an important multifunctional geophysical method for research in periglacial permafrost related environments. Joint application with measurements of surface displacements offers a promising tool for investigating periglacial landforms related to ice‐rich permafrost for a more comprehensive characterization of permafrost characteristics and geomorphological interpretation of periglacial morphodynamics. The patchy permafrost distribution pattern described in this paper is determined by several factors, including the sediment characteristics, the snow cover distribution and duration, the aspect and the former glacier distribution and thermal regime. Recent and modern permafrost dynamics within the glacier forefield comprise aggradation, degradation and permafrost creep. Copyright © 2007 John Wiley & Sons, Ltd.