Comparison of Carbon-based Nanostructures with Commercial Products as Thermal Interface Materials

• Published in: MRS Proceedings
• Main Authors: Rosshirt, Michael, Fabris, Drazen, Cardenas, Christopher, Wilhite, Patrick, Tu, Thanh, Yang, Cary Y.
• Format: Article in Journal/Newspaper
• Language: English
• Published: Springer Science and Business Media LLC 2009
• Subjects: General Engineering; Arctic
• Online Access: http://dx.doi.org/10.1557/proc-1158-f03-03; https://www.cambridge.org/core/services/aop-cambridge-core/content/view/S1946427400007831

Abstract Heat dissipation in electronics packaging can be highly dependent on Thermal Interface Materials (TIM). TIM contact, compliance, and conductivity can be the dominant limiting factors in the overall conduction heat transfer across the interface. Mixing multiwall Carbon Nanotubes (CNTs), which have high thermal conductivity, with other thermally conducting materials holds great promise as TIM fillers and has been shown to have higher thermal performance than commercial TIM ‘1’. Such mixtures possess greater thermal conductivity as a result of increased thermal conduction paths through highly conductive, high aspect ratio CNTs. In this work, we develop and test an advanced apparatus based on the ASTM D5470-06 standard to measure thermal interface resistance. Our experimental findings quantify the thermal performance trends of industry-standard TIM Arctic Silver® 5 along with hybrid TIM mixtures of Arctic Silver®5 and varying weight ratios of CNTs. Early experimental findings show that Arctic Silver®5 mixed with 0.5 to 1% multiwall CNT by weight may improve thermal conductivity over pure Arctic Silver®5.The goal of this research is to investigate the viability of integrating CNTs with commercial products as improved TIM for electronic cooling in chip packages.