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Zilmer, G.
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Wafer-level chip-scale packaging for low-end RF products
by
Bartek, M.
,
Zilmer
,
G
.
,
Teomin, D.
,
Polyakov, A.
,
Sinaga, S. M.
,
Mendes, P. M.
,
Burghartz, J. N.
Published 2004
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Related Subjects
Chip scale packaging CSP
Crosstalk suppression
Embedded passives
System-on-chip Soc
Wafer level packaging WLP
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