Quantitative comparison of electronic component/solder joint stress relief in encapsulated assemblies

• Main Author: Cummings, D.A.
• Format: Article in Journal/Newspaper
• Language: English
• Published: Bendix Corporation 1979
• Subjects: Elements; Organic Compounds; Electronic Equipment; Dispersions; Elastomers; Foams; Rubbers; Encapsulation; Sleeves; Soldered Joints; Polymers; Urethane; Organic Oxygen Compounds; Carboxylic Acid Salts; Silicon; Joints; Semimetals 360603* > Materials > Properties; Carbonic Acid Derivatives; Organic Polymers; Epoxides; 36 Materials Science; Organic Nitrogen Compounds; Colloids; Stress Relaxation; Carbamates; Carbonic acid
• Online Access: https://digital.library.unt.edu/ark:/67531/metadc1205633/

A quantitative comparison was made of various stress relief bends with and without sleeving in three commonly used encapsulants. Silicone rubber and heat shrinkable polyolifin sleeving were used on right angle, full loop, and hump style lead bends. Small (from 254 .mu.m to 762 .mu.m diameter) and large (762 .mu.m to 1.27 mm diameter) wires were used to simulate small and large component leads. The component leads were encapsulated in microballoon-filled epoxy, 128 kg/m/sup 3/ urethane foam, and 320 kg/m/sup 3/ urethane foam. Ten test samples were fabricated in each configuration; five were used for tensile loading, and five were used for compressive loading.