Warpage Prediction of Electronic Underfill Components During Curing
To ensure the shelf life of a semiconductor, the integrated circuits are usually embedded in an epoxy molding compound (EMC) to shield it from stress and corrosion. The EMC is a viscoelastic material and is categorized as a thermoset. Working with viscoelastic material appose a challenge due to the...
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| Format: | Bachelor Thesis |
| Language: | English |
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Umeå universitet, Institutionen för fysik
2021
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| Online Access: | http://urn.kb.se/resolve?urn=urn:nbn:se:umu:diva-190888 |