Development of Electronics for Low-Temperature Space Missions

Electronic systems that are capable of operating at cryogenic temperatures will be needed for many future NASA space missions, including deep space probes and spacecraft for planetary surface exploration. In addition to being able to survive the harsh deep space environment, low-temperature electron...

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Main Authors: Dickman, John E., Patterson, Richard L., Hammoud, Ahmad, Overton, Eric, Gerber, Scott S.
Format: Other/Unknown Material
Language:unknown
Published: 2001
Subjects:
Online Access:http://hdl.handle.net/2060/20010019001
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spelling ftnasantrs:oai:casi.ntrs.nasa.gov:20010019001 2023-05-15T15:05:56+02:00 Development of Electronics for Low-Temperature Space Missions Dickman, John E. Patterson, Richard L. Hammoud, Ahmad Overton, Eric Gerber, Scott S. Unclassified, Unlimited, Publicly available January 2001 application/pdf http://hdl.handle.net/2060/20010019001 unknown Document ID: 20010019001 http://hdl.handle.net/2060/20010019001 No Copyright CASI Electronics and Electrical Engineering NASA/TM-2001-210235 NAS 1.15:210235 E-12354 European Workshop: Low Temperature Electronics; 21-23 Jun. 2000; Noordwijk; Netherlands 2001 ftnasantrs 2019-07-21T02:48:56Z Electronic systems that are capable of operating at cryogenic temperatures will be needed for many future NASA space missions, including deep space probes and spacecraft for planetary surface exploration. In addition to being able to survive the harsh deep space environment, low-temperature electronics would help improve circuit performance, increase system efficiency, and reduce payload development and launch costs. Terrestrial applications where components and systems must operate in low-temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation systems, and arctic exploration. An ongoing research and development project for the design, fabrication, and characterization of low-temperature electronics and supporting technologies at NASA Glenn Research Center focuses on efficient power systems capable of surviving in and exploiting the advantages of low-temperature environments. Supporting technologies include dielectric and insulating materials, semiconductor devices, passive power components, optoelectronic devices, and packaging and integration of the developed components into prototype flight hardware. An overview of the project is presented, including a description of the test facilities, a discussion of selected data from component testing, and a presentation of ongoing research activities being performed in collaboration with various organizations. Other/Unknown Material Arctic NASA Technical Reports Server (NTRS) Arctic
institution Open Polar
collection NASA Technical Reports Server (NTRS)
op_collection_id ftnasantrs
language unknown
topic Electronics and Electrical Engineering
spellingShingle Electronics and Electrical Engineering
Dickman, John E.
Patterson, Richard L.
Hammoud, Ahmad
Overton, Eric
Gerber, Scott S.
Development of Electronics for Low-Temperature Space Missions
topic_facet Electronics and Electrical Engineering
description Electronic systems that are capable of operating at cryogenic temperatures will be needed for many future NASA space missions, including deep space probes and spacecraft for planetary surface exploration. In addition to being able to survive the harsh deep space environment, low-temperature electronics would help improve circuit performance, increase system efficiency, and reduce payload development and launch costs. Terrestrial applications where components and systems must operate in low-temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation systems, and arctic exploration. An ongoing research and development project for the design, fabrication, and characterization of low-temperature electronics and supporting technologies at NASA Glenn Research Center focuses on efficient power systems capable of surviving in and exploiting the advantages of low-temperature environments. Supporting technologies include dielectric and insulating materials, semiconductor devices, passive power components, optoelectronic devices, and packaging and integration of the developed components into prototype flight hardware. An overview of the project is presented, including a description of the test facilities, a discussion of selected data from component testing, and a presentation of ongoing research activities being performed in collaboration with various organizations.
format Other/Unknown Material
author Dickman, John E.
Patterson, Richard L.
Hammoud, Ahmad
Overton, Eric
Gerber, Scott S.
author_facet Dickman, John E.
Patterson, Richard L.
Hammoud, Ahmad
Overton, Eric
Gerber, Scott S.
author_sort Dickman, John E.
title Development of Electronics for Low-Temperature Space Missions
title_short Development of Electronics for Low-Temperature Space Missions
title_full Development of Electronics for Low-Temperature Space Missions
title_fullStr Development of Electronics for Low-Temperature Space Missions
title_full_unstemmed Development of Electronics for Low-Temperature Space Missions
title_sort development of electronics for low-temperature space missions
publishDate 2001
url http://hdl.handle.net/2060/20010019001
op_coverage Unclassified, Unlimited, Publicly available
geographic Arctic
geographic_facet Arctic
genre Arctic
genre_facet Arctic
op_source CASI
op_relation Document ID: 20010019001
http://hdl.handle.net/2060/20010019001
op_rights No Copyright
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