絶縁用封止剤として使われるエポキシ樹脂硬化反応の解析 : 第1報 硬化反応の速度論的解析

Epoxy resins have been widely used as insulators in electronic devices because of the in excellent electrical properties. Cracking of the epoxy resin (interface) is a problem during the curing process, hence many experimental investigations on the causes have been performed. Few studies have dealt w...

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Main Authors: 福永 守高, 山田 敏郎, 加納 重義, 蒲生 正浩
Format: Article in Journal/Newspaper
Language:Japanese
Published: The Japan Society of Polymer Processing = プラスチック成形加工学会 2002
Subjects:
Online Access:http://hdl.handle.net/2297/36561
https://kanazawa-u.repo.nii.ac.jp/?action=repository_uri&item_id=10521
https://kanazawa-u.repo.nii.ac.jp/?action=repository_action_common_download&item_id=10521&item_no=1&attribute_id=26&file_no=1
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spelling ftkanazawauninii:oai:kanazawa-u.repo.nii.ac.jp:00010521 2023-09-05T13:18:48+02:00 絶縁用封止剤として使われるエポキシ樹脂硬化反応の解析 : 第1報 硬化反応の速度論的解析 福永 守高 山田 敏郎 加納 重義 蒲生 正浩 2002-06-20 http://hdl.handle.net/2297/36561 https://kanazawa-u.repo.nii.ac.jp/?action=repository_uri&item_id=10521 https://kanazawa-u.repo.nii.ac.jp/?action=repository_action_common_download&item_id=10521&item_no=1&attribute_id=26&file_no=1 ja jpn The Japan Society of Polymer Processing = プラスチック成形加工学会 10.4325/seikeikakou.14.371 https://www.jstage.jst.go.jp/browse/seikeikakou/-char/ja/ http://ci.nii.ac.jp/naid/10009505082/ http://www.jspp.or.jp/ https://kanazawa-u.repo.nii.ac.jp/?action=repository_uri&item_id=10521 http://hdl.handle.net/2297/36561 成形加工 = Journal of the Japan Society of Polymer Processing, 14(6), 371-377(2002-06-20) 0915-4027 AN10278882 https://kanazawa-u.repo.nii.ac.jp/?action=repository_action_common_download&item_id=10521&item_no=1&attribute_id=26&file_no=1 Copyright © The Japan Society of Polymer Processing プラスチック成形加工学会 Epoxy resin Curing rate Titration Finite element analysis Journal Article 2002 ftkanazawauninii 2023-08-17T05:51:48Z Epoxy resins have been widely used as insulators in electronic devices because of the in excellent electrical properties. Cracking of the epoxy resin (interface) is a problem during the curing process, hence many experimental investigations on the causes have been performed. Few studies have dealt with this problem by numerical methods because the relationship among the reaction rate, temperature, stress, and strain is too complex to be expressed numerically. The finite element analysis method with a coupled matrix of the relationships is the most suitable for implementation. The results determined with numerical analysis is useful for designing electronic devices, although many parameters are necessary to accomplish the analysis. This paper reports on the kinetic analysis of the curing reaction between an epoxide (Epikote 828) and a carbonic acid anhydride (HN-2200) using a finite element analysis with a coupled matrix. The degree of reaction at a given temperature was determined by titration of the unreacted acid and epoxy groups in the system. Because the curing rates obtained by a power law model were not in good agreement with experiment, the curing rate was expressed as a function of temperature and the degree of reaction by means of a multiple regression analysis. To deal with the curing rate in the finite element analysis, the degree of reaction was defined as one of the variables at the Gaussian integration points in finite elements. Consequently, the analytical results with the new finite element model were in good agreement with the experimental data. This numerical method would be available for predicting the strain in epoxy resins and the degree of reaction throughout the curing process. Article in Journal/Newspaper Carbonic acid Kanazawa University Repository for Academic Resources (KURA)
institution Open Polar
collection Kanazawa University Repository for Academic Resources (KURA)
op_collection_id ftkanazawauninii
language Japanese
topic Epoxy resin
Curing rate
Titration
Finite element analysis
spellingShingle Epoxy resin
Curing rate
Titration
Finite element analysis
福永 守高
山田 敏郎
加納 重義
蒲生 正浩
絶縁用封止剤として使われるエポキシ樹脂硬化反応の解析 : 第1報 硬化反応の速度論的解析
topic_facet Epoxy resin
Curing rate
Titration
Finite element analysis
description Epoxy resins have been widely used as insulators in electronic devices because of the in excellent electrical properties. Cracking of the epoxy resin (interface) is a problem during the curing process, hence many experimental investigations on the causes have been performed. Few studies have dealt with this problem by numerical methods because the relationship among the reaction rate, temperature, stress, and strain is too complex to be expressed numerically. The finite element analysis method with a coupled matrix of the relationships is the most suitable for implementation. The results determined with numerical analysis is useful for designing electronic devices, although many parameters are necessary to accomplish the analysis. This paper reports on the kinetic analysis of the curing reaction between an epoxide (Epikote 828) and a carbonic acid anhydride (HN-2200) using a finite element analysis with a coupled matrix. The degree of reaction at a given temperature was determined by titration of the unreacted acid and epoxy groups in the system. Because the curing rates obtained by a power law model were not in good agreement with experiment, the curing rate was expressed as a function of temperature and the degree of reaction by means of a multiple regression analysis. To deal with the curing rate in the finite element analysis, the degree of reaction was defined as one of the variables at the Gaussian integration points in finite elements. Consequently, the analytical results with the new finite element model were in good agreement with the experimental data. This numerical method would be available for predicting the strain in epoxy resins and the degree of reaction throughout the curing process.
format Article in Journal/Newspaper
author 福永 守高
山田 敏郎
加納 重義
蒲生 正浩
author_facet 福永 守高
山田 敏郎
加納 重義
蒲生 正浩
author_sort 福永 守高
title 絶縁用封止剤として使われるエポキシ樹脂硬化反応の解析 : 第1報 硬化反応の速度論的解析
title_short 絶縁用封止剤として使われるエポキシ樹脂硬化反応の解析 : 第1報 硬化反応の速度論的解析
title_full 絶縁用封止剤として使われるエポキシ樹脂硬化反応の解析 : 第1報 硬化反応の速度論的解析
title_fullStr 絶縁用封止剤として使われるエポキシ樹脂硬化反応の解析 : 第1報 硬化反応の速度論的解析
title_full_unstemmed 絶縁用封止剤として使われるエポキシ樹脂硬化反応の解析 : 第1報 硬化反応の速度論的解析
title_sort 絶縁用封止剤として使われるエポキシ樹脂硬化反応の解析 : 第1報 硬化反応の速度論的解析
publisher The Japan Society of Polymer Processing = プラスチック成形加工学会
publishDate 2002
url http://hdl.handle.net/2297/36561
https://kanazawa-u.repo.nii.ac.jp/?action=repository_uri&item_id=10521
https://kanazawa-u.repo.nii.ac.jp/?action=repository_action_common_download&item_id=10521&item_no=1&attribute_id=26&file_no=1
genre Carbonic acid
genre_facet Carbonic acid
op_relation 10.4325/seikeikakou.14.371
https://www.jstage.jst.go.jp/browse/seikeikakou/-char/ja/
http://ci.nii.ac.jp/naid/10009505082/
http://www.jspp.or.jp/
https://kanazawa-u.repo.nii.ac.jp/?action=repository_uri&item_id=10521
http://hdl.handle.net/2297/36561
成形加工 = Journal of the Japan Society of Polymer Processing, 14(6), 371-377(2002-06-20)
0915-4027
AN10278882
https://kanazawa-u.repo.nii.ac.jp/?action=repository_action_common_download&item_id=10521&item_no=1&attribute_id=26&file_no=1
op_rights Copyright © The Japan Society of Polymer Processing プラスチック成形加工学会
_version_ 1776199676586885120