A solvent-free processed low-temperature tolerant adhesive

• Published in: Nature Communications
• Main Authors: Xiaoming Xie, Yulian Jiang, Xiaoman Yao, Jiaqi Zhang, Zilin Zhang, Taoping Huang, Runhan Li, Yifa Chen, Shun-Li Li, Ya-Qian Lan
• Format: Article in Journal/Newspaper
• Language: English
• Published: Nature Portfolio 2024
• Subjects: Science; Q; Antarc*; Antarctic
• Online Access: https://doi.org/10.1038/s41467-024-49503-7; https://doaj.org/article/4f13296c5c274ba0844b13df69e92df5

Abstract Ultra-low temperature resistant adhesive is highly desired yet scarce for material adhesion for the potential usage in Arctic/Antarctic or outer space exploration. Here we develop a solvent-free processed low-temperature tolerant adhesive with excellent adhesion strength and organic solvent stability, wide tolerable temperature range (i.e. −196 to 55 °C), long-lasting adhesion effect ( > 60 days, −196 °C) that exceeds the classic commercial hot melt adhesives. Furthermore, combine experimental results with theoretical calculations, the strong interaction energy between polyoxometalate and polymer is the main factor for the low-temperature tolerant adhesive, possessing enhanced cohesion strength, suppressed polymer crystallization and volumetric contraction. Notably, manufacturing at scale can be easily achieved by the facile scale-up solvent-free processing, showing much potential towards practical application in Arctic/Antarctic or planetary exploration.